Application of MQ silicone resin in thermal conductive potting glue
MQ silicone resin (methyl MQ silicone resin) plays an important role in thermal conductive potting glue due to its unique inorganic-organic hybrid structure. It is mainly used in electronic packaging, power modules, LED drivers, new energy vehicle battery management systems (BMS) and other scenarios that require heat dissipation and protection.
1. The role of MQ silicone resin in thermal conductive potting glue
(1) Enhance thermal conductivity
- MQ silicone resin itself has a low thermal conductivity (~0.2 W/m·K), but it can be used as a matrix resin and combined with high thermal conductivity fillers (such as Al₂O₃, BN, SiC, AlN, etc.) to form a stable thermal conductive network.
- Its low molecular weight and high compatibility help the filler to be evenly dispersed, reduce the interface thermal resistance, and improve the overall thermal conductivity (up to 1-5 W/m·K).
(2) Improve mechanical strength and heat resistance
- The rigid Q segment (SiO₄/₂) of MQ silicone resin can enhance the hardness of the potting compound (Shore A 30-80) and prevent cracking or sedimentation.
- High temperature resistance (200-300℃), suitable for long-term working environment of high-power electronic devices.
(3) Optimize rheological properties
- Adjusting the content of MQ resin can control the viscosity of the potting compound, making it suitable for different processes such as pouring, injection or spraying.
- Low shrinkage after curing, reducing internal stress and avoiding component damage.
4) Electrical insulation and moisture protection
- MQ silicone resin has excellent dielectric properties (volume resistivity>10¹⁵ Ω·cm), suitable for high-voltage insulation packaging.
- Strong hydrophobicity, can prevent water vapor penetration and extend the life of electronic components.
2. Typical application scenarios
Application fields Specific uses
Power electronics: thermal insulation potting of IGBT modules, inverters, and power modules
LED drivers: heat dissipation packaging of high-brightness LED lamps and automotive LEDs
New energy vehicles: heat dissipation and protection of battery management systems (BMS) and motor controllers
5G communications: thermal potting of base station power amplifiers and RF modules
Consumer electronics: heat dissipation protection of fast charging chargers and wireless charging modules